Events

The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

Register for the Xecs Matchmaking Event - Xecs Call 5 on 9 October 2025, join the Electronics Components and Systems community, be part of a global ecosystem and participate in the Xecs Call 5.